- An earthquake on a chip: New tech could make smartphones smaller, faster Tech Xplore
- An electrically injected solid-state surface acoustic wave phonon laser Nature
- “The Waves From an Earthquake, Only On the Surface of a Small Chip”: This Vibrating Laser May Be the Future of Wireless Technology The Debrief
- This chip can make future phones thinner and faster through tiny ‘earthquakes’ Digital Trends
- ‘Tiniest earthquakes’ could shrink and speed up future smartphones Interesting Engineering
iOS 26.3 release date: Here’s when the next iPhone update will arrive – 9to5Mac
iOS 26.3 release date: Here’s when the next iPhone update will arrive 9to5Mac
