An earthquake on a chip: New tech could make smartphones smaller, faster – Tech Xplore

  1. An earthquake on a chip: New tech could make smartphones smaller, faster  Tech Xplore
  2. An electrically injected solid-state surface acoustic wave phonon laser  Nature
  3. “The Waves From an Earthquake, Only On the Surface of a Small Chip”: This Vibrating Laser May Be the Future of Wireless Technology  The Debrief
  4. This chip can make future phones thinner and faster through tiny ‘earthquakes’  Digital Trends
  5. ‘Tiniest earthquakes’ could shrink and speed up future smartphones  Interesting Engineering
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